Integrated circuit package system employing device stacking and method of manufacture thereof

ABSTRACT

A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of U.S. patent application Ser. No. 11/766,787filed Jun. 21, 2007, now U.S. Pat. No. 7,830,020.

TECHNICAL FIELD

The present invention relates generally to integrated circuits, and moreparticularly to an integrated circuit package system employing devicestacking.

BACKGROUND ART

Integrated circuits and integrated circuit package systems can be foundin a multitude of electronic devices, such as cell phones, pocket PCs,digital cameras, automobile engines, and many other portable/wirelessproducts. Today's customers and electronics systems are demanding thatthese integrated circuit systems provide maximum functional integrationof memory and logic within the smallest footprint, lowest profile, andlowest cost package available. Consequently, manufacturer's are turningto three-dimensional packaging to achieve the required high level offunctional integration necessary to support these mobile electronicproducts.

Various techniques have been developed to meet the continued demands forimproving functional integration and circuit density within athree-dimensional package. Unfortunately, leadframe basedthree-dimensional packages have lagged in their ability to handle theincrease in circuit density required of high level functionallyintegrated systems. Typically, leadframe packaging has its limit whenproviding acceptable solutions for three-dimensional integration due tofactors such as, increased package thickness, a larger footprint area,and insufficient input/output leads to handle the higher circuitdensity.

Thus, a need still remains for a reliable integrated circuit packagesystem and method of fabrication, wherein the integrated circuit packagesystem permits high density three-dimensional device stacking within thesame interconnect level. In view of the ever-increasing commercialcompetitive pressures, increasing consumer expectations, and diminishingopportunities for meaningful product differentiation in the marketplace,it is increasingly critical that answers be found to these problems.Moreover, the ever-increasing need to save costs, improve efficiencies,and meet such competitive pressures adds even greater urgency to thecritical necessity that answers are found to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method of manufacture of an integratedcircuit package system including: providing an electrical interconnectsystem including an inner lead-finger system and an outer lead-fingersystem; stacking a first device, a second device, and a third devicebetween and over the electrical interconnect system; connecting thefirst device and the second device to the inner lead-finger system; andconnecting the third device to the outer lead-finger system.

The present invention provides an integrated circuit package system,including: an electrical interconnect system including an innerlead-finger system and an outer lead-finger system; a first device, asecond device, and a third device between and over the electricalinterconnect system; the first device and the second device electricallyconnected to the inner lead-finger system; and the third deviceelectrically connected to the outer lead-finger system.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned above. The aspects will become apparentto those skilled in the art from a reading of the following detaileddescription when taken with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an integrated circuit packagesystem, in accordance with an embodiment of the present invention;

FIG. 2 is a cross-sectional view of an integrated circuit packagesystem, of FIG. 1, in an initial stage of manufacture, in accordancewith an embodiment of the present invention;

FIG. 3 is the structure of FIG. 2 during placement of a first device;

FIG. 4 is the structure of FIG. 3 after attachment of a first device andformation of a wire bond;

FIG. 5 is the structure of FIG. 4 after placement of a second device;

FIG. 6 is the structure of FIG. 5 after placement of a third device;

FIG. 7 is the structure of FIG. 6 after formation of a wire bond;

FIG. 8 is the structure of FIG. 7 after formation of an encapsulationmaterial; and

FIG. 9 is a flow chart of an integrated circuit package system for anintegrated circuit package system in accordance with an embodiment ofthe present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that process or mechanical changes may be made withoutdeparting from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

Likewise, the drawings showing embodiments of the system aresemi-diagrammatic and not to scale and, particularly, some of thedimensions are for the clarity of presentation and are shown exaggeratedin the drawing FIGs. Additionally, where multiple embodiments aredisclosed and described having some features in common, for clarity andease of illustration, description, and comprehension thereof, similarand like features one to another will ordinarily be described with likereference numerals.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional plane or surface of an electrical interconnect system,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “on”,“above”, “below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”,“lower”, “upper”, “over”, and “under”, are defined with respect to thehorizontal plane.

The terms “processed” or “processing” as used herein includes depositionof material or photoresist, patterning, exposure, development, etching,cleaning, and/or removal of the material or photoresist as required informing a described structure.

The terms “half-etched”, “half-etching”, “stamped” or “stamping” as usedherein includes removing a portion of an electrical interconnect systemin a thickness direction that may be substantially equivalent to half,less than half, or greater than half of the thickness of the electricalinterconnect system. However, in no event will “half-etched”,“half-etching”, “stamped” or “stamping” be defined to include removal ofthe entire thickness of the electrical interconnect system.

The terms “example” or “exemplary” are used herein to mean serving as aninstance or illustration. Any aspect or embodiment described herein asan “example” or as “exemplary” is not necessarily to be construed aspreferred or advantageous over other aspects or designs.

The terms “first”, “second”, and “third” as used herein are for purposesof differentiation between elements only and are not to be construed aslimiting the scope of the present invention.

Referring now to FIG. 1 therein is shown a cross-sectional view of anintegrated circuit package system 100, in accordance with an embodimentof the present invention. As an exemplary illustration, the integratedcircuit package system 100 may generally be used within a portableelectronics device that requires a high level of functional integration,such as a cell phone or computer.

The integrated circuit package system 100 includes a first device 102, asecond device 104 and a third device 106 stacked between and/or over anelectrical interconnect system 108. By way of example, each of the firstdevice 102, the second device 104 and the third device 106 may includesemiconductor chips and integrated circuit packages selected from activecomponents, passive components, processor components, memory components,logic components, digital components, analog components, powercomponents, and so forth, in numerous configurations and arrangements asmay be needed. As exemplary illustrations, each of the first device 102,the second device 104 and the third device 106 may more specificallyinclude a digital signal processor, an application specific integratedcircuit, a flip-chip configuration, a graphical processor unit, flashmemory, dynamic random access memory (DRAM), magnetic random accessmemory (MRAM), static random access memory (SRAM), an optical sensordevice, a micro-electro-mechanical device, a radio frequency (RF)device, and/or a combination thereof.

Furthermore, it is to be understood that each of the first device 102,the second device 104, and the third device 106 may also includePackage-in-Package (PiP) and Package-on-Package (PoP) configurations.The PiP system is a 3D package system that stacks a fully testedInternal Stacking Module (ISM) on top of a Base Assembly Package (BAP)to form a single Chip Scale Package (CSP). PoP is a 3D package in whichfully tested packages are stacked on top of another single or stackedpackage during the board and/or electrical interconnect mount process.

In accordance with the present invention each of the first device 102,the second device 104 and the third device 106 covers a wide range ofsemiconductor chip and integrated circuit package configurationsinvolving various types, sizes, dimensions, and electrical contacttechniques, and the kind of chip or package configuration employedshould only be limited by the design specifications of the integratedcircuit package system 100.

An inter-device structure 110 may separate the second device 104 and thethird device 106. The inter-device structure 110 may include an adhesivewith or without thermally conducting capabilities, a spacer, anelectromagnetic interference shield for blocking potentially disruptiveenergy fields, or a combination thereof. For example, if theinter-device structure 110 is an adhesive layer, the adhesive layer mayinclude a film or a partially unconsolidated (e.g.—a liquid or a gel)adhesive material, which allows the third device 106 to self-align overthe second device 104. Furthermore, if the inter-device structure 110 isan adhesive layer, the adhesive layer can be deposited in any pattern orshape (e.g.—a zero fillet configuration), which facilitates the adhesionof the third device 106 to the second device 104.

The electrical interconnect system 108 may include a lead-finger systemdefined by an inner lead-finger system 112 and an outer lead-fingersystem 114. The outer lead-finger system 114 is typically formedintegrally with the inner lead-finger system 112 and the outerlead-finger system 114 may extend from the package body for establishingan external electrical connection. For purposes of illustration, theelectrical interconnect system 108 can be made from a conductingmaterial such as copper.

By way of example, the electrical interconnect system 108 may include athin metal sheet, a conductive plated pattern on plastic tape, or anystructure suitable for supporting and/or electrically interconnectingthe first device 102, the second device 104, and the third device 106 toexternal electrical circuits. For purposes of illustration, theelectrical interconnect system 108 can be exemplified by a leadframewith a lead-finger system including single in-line leads, dual in-lineleads, quad flat pack leads, gull-wing leads, j-leads, leadless leadsthat wrap around the package edge to maintain a low profile, pin gridarray leads, or ball grid array leads. However, it is to be understoodthat the present invention is not to be limited to these examples. Inaccordance with the present invention, the electrical interconnectsystem 108 may include any electrical interconnection structure(i.e.—leads) that facilitates the incorporation of the integratedcircuit package system 100 into a higher-level assembly, such as aprinted circuit board or other suitable structure for supporting theintegrated circuit package system 100.

In an aspect of a preferred embodiment, the electrical interconnectsystem 108 may include a single row or dual row lead/land configurationthat has been half-etched or stamped. More specifically, the electricalinterconnect system 108 may include a single row or dual row lead/landconfiguration, wherein the inner lead-finger system 112 has beenhalf-etched or stamped for purposes of subsequently forming a wire bondcontact 116 and a bump contact 120.

The wire bond contact 116 can be used for electrically interconnectingeach of the first device 102 and the third device 106 to externalelectrical circuits through the electrical interconnect system 108. Thewire bond contact 116 may include a region pre-plated with, but notlimited to, nickel, palladium, lead, tin, gold, and alloys thereof. Byway of example, the wire bond contact 116 can be electrically attachedto the first device 102 and the third device 106 by a wire bond 118. Thewire bond 118 can be deposited using materials and techniques well knownwithin the art and is currently only limited by the technology of wirebond equipment and the minimum required operating space.

The bump contact 120 can be used for electrically interconnecting thesecond device 104 to external electrical circuits through the electricalinterconnect system 108. By way of example, the bump contact 120 can beelectrically attached to the second device 104 by a bump bond 122.Notably, the bump contact 120 of the present invention includes a groove124 formed adjacent a mesa 126. In an aspect of a preferred embodiment,the mesa 126 can be defined by the groove 124, as the depth of thegroove 124 is substantially equal to the height of the mesa 126.

Although, the present embodiment depicts the groove 124 formed onopposing sides of the mesa 126, it is to be understood that the groove124 may be formed on one or more sides of the mesa 126 or continuouslyaround the mesa 126. Further, it is to be understood that one or more ofthe groove 124 may be formed per side of the mesa 126. Moreover, thegroove 124 may include any design or shape, such as circular,triangular, or rectangular, for example. Furthermore, the depth of thegroove 124 is not to be limited to the height of the mesa 126 and mayinclude any depth that helps to minimize electrical shortingoccurrences.

Those skilled in the art will recognize that the mesa 126 can beconfigured to receive the bump bond 122 and that the groove 124 can bedesigned to accommodate excess solder that flows off of the mesa 126during reflow, thereby helping to prevent electrical shorts caused bythe migration of excess solder. Furthermore, it is to be understood thatthe groove 124 and the mesa 126 may further include a combination ofsolder wettable and solder non-wettable regions configured andengineered to reduce the occurrence of electrical shorts from excesssolder.

Hereinafter, exemplary package dimensions are provided for theintegrated circuit package system 100, however, it is to be understoodthat these dimensions are provided merely for purposes of illustrationand are not to be construed as limiting the scope of the presentinvention or the claims appended hereto. By way of example, theintegrated circuit package system 100 may possess the followingdimensions: a first device thickness 128 of about 0.1 millimeters; asecond device thickness 130 of about 0.15 millimeters; a third devicethickness 132 of about 0.1 to about 0.15 millimeters; an outerlead-finger system thickness 134 of about 0.2 millimeters; an innerlead-finger system thickness 136 of about 0.15 millimeters; a firstdevice loop height 138 of about 0.075 millimeters; a second device bumpheight 140 of about 0.1 millimeters; a third device loop height 142 ofabout 0.15 millimeters; a mold cap height 144 of about 0.65 millimeters;a mold cap clearance height 146 of about 0.1 millimeters; and aninter-device structure height 148 of about 0.01 to about 0.05millimeters.

Notably, the electrical interconnect system 108 of the integratedcircuit package system 100 does not include a paddle. By eliminating theneed for a paddle, the profile of the integrated circuit package system100 is greatly reduced. However, it is to be understood that the scopeof the present invention may include the use of a paddle for purposes ofstructural stability, for example.

Moreover, the profile of the integrated circuit package system 100 canbe further reduced by employing thin and ultra-thin devices for thefirst device 102, the second device 104, and the third device 106.Through the use of thin and ultra-thin devices, the integrated circuitpackage system 100 may achieve a package height of about one millimeteror less, even when employing similarly sized devices or differentlysized devices for the second device 104 and the third device 106.Notably, this reduced profile package design of the integrated circuitpackage system 100 naturally improves the thermal dissipation ability ofthe integrated circuit package system 100 because the heat flux of asolid object is inversely proportional to the thickness of the object,noting Fourier's law of heat conduction in solids.

Additionally, the present invention further enhances the thermaldissipation ability of the integrated circuit package system 100 byexposing a first device backside 150 to an external environment. Thisimproved thermal dissipation ability can be further enhanced byattaching a thermally conductive substrate or a heat sink adjacent thefirst device backside 150. By improving the ability of the integratedcircuit package system 100 to dissipate heat, the reliability and theuseful life of the integrated circuit package system 100 can beimproved.

Moreover, it is to be understood that standard packages or devices maybe used for the first device 102, the second device 104, and the thirddevice 106, thereby reducing the cost of manufacturing the integratedcircuit package system 100.

Another notable aspect of the present invention is that it allows fortesting of the first device 102, the second device 104 and the thirddevice 106 before adhering them to the electrical interconnect system108, therefore ensuring the use of known good die or packages in themanufacturing process. Additionally, after adhering the first device102, the second device 104, and the third device 106 to the electricalinterconnect system 108, these assemblies can also be tested beforeincorporation into additional package systems. This ensures that thefinal product includes known good assemblies, and thereby improves themanufacturing process yield for packaging.

An encapsulation material 152, such as a plastic molding compound, isdeposited over the integrated circuit package system 100. Notably, theencapsulation material 152 does not cover at least a portion of anelectrical interconnect system bottom side 154 and at least a portion ofthe first device backside 150. By leaving the electrical interconnectsystem bottom side 154 and the first device backside 150 exposed to theexternal environment, the ability of the integrated circuit packagesystem 100 to dissipate heat is greatly improved. Furthermore, byexposing the electrical interconnect system bottom side 154, theintegrated circuit package system 100 may optionally include anelectrical contact 156 for permitting a higher density concentration ofinput/output leads.

Moreover, the encapsulation material 152 not only protects theintegrated circuit package system 100 from the external environment butit may also provide overall structural support and stability to theintegrated circuit package system 100. The encapsulation material 152and molding techniques using it are well known in the art and notrepeated herein.

FIGS. 2-8, which follow, depict by way of example and not by limitation,an exemplary process flow for the formation of the integrated circuitpackage system 100, of FIG. 1, and they are not to be construed aslimiting. Accordingly, it is to be understood that many modifications,additions, and/or omissions may be made to the below described processflow without departing from the scope or spirit of the claimed subjectmatter. For example, the process may include more, fewer, or othersteps. Additionally, since the structure and elements of FIGS. 2-8 arethe same as the structure and elements of FIG. 1, identical numeralshave been used and explanations thereof are omitted.

Although FIGS. 2-8 depict the formation of one of the integrated circuitpackage system 100, it is to be understood that one or more of theintegrated circuit package system 100 can be prepared at one time on asupport structure, which could then be separated into individual ormultiple semiconductor assemblies at a later stage of fabrication.

Referring now to FIG. 2, therein is shown a cross-sectional view of theintegrated circuit package system 100, of FIG. 1, in an initial stage ofmanufacture, in accordance with an embodiment of the present invention.The electrical interconnect system 108 includes the inner lead-fingersystem 112, the outer lead-finger system 114, the wire bond contact 116,the bump contact 120, the groove 124, the mesa 126, and the electricalcontact 156.

This cross-sectional view depicts attaching the electrical interconnectsystem 108 to a support medium 200, such as a tape that is part of atape and reel configuration, for example. However, it is to beunderstood that the support medium 200 is not limited to the precedingexample and the support medium 200 may include any structure that helpsto support the electrical interconnect system 108 during manufacture.

An opening 202 is provided within the electrical interconnect system108. The opening 202 provides a recess for the subsequent placement ofthe first device 102, of FIG. 1, between portions of the innerlead-finger system 112. Generally, the perimeter or dimensions of theopening 202 are defined by the inner lead-finger system 112. It is to beunderstood that the dimensions of the opening 202 can be minimized tohelp reduce the overall footprint of the integrated circuit packagesystem 100 or the dimensions of the opening 202 can be made larger tohelp reduce per unit product costs, for example.

By way of example, the opening 202 can be formed within the electricalinterconnect system 108 by punching or etching.

Referring now to FIG. 3, therein is shown the structure of FIG. 2 duringplacement of the first device 102. Per this embodiment, the first device102 is centrally aligned within the opening 202 of the electricalinterconnect system 108.

Referring now to FIG. 4, therein is shown the structure of FIG. 3 afterattachment of the first device 102 and formation of the wire bond 118.Per this embodiment, the first device 102 is attached to the supportmedium 200 and the wire bond 118 is formed. Generally, the placement orlocation of the first device 102 can be described as between the innerlead-finger system 112.

Notably, the surface of the electrical interconnect system 108 attachedto the support medium 200 is substantially coplanar with the firstdevice backside 150. By allowing the first device 102 to be mountedwithin the opening 202 of the electrical interconnect system 108, theoverall dimensions of the integrated circuit package system 100 may bereduced by utilizing the thickness of the electrical interconnect system108 to accommodate the first device 102.

A first device active side 300 has been left exposed for furtherprocessing steps, such as wire bonding. Notably, the wire bond 118between the first device 102 and the wire bond contact 116 of the innerlead-finger system 112 can exhibit a low loop height due to thehalf-etch profile employed on the inner lead-finger system 112.

Referring now to FIG. 5, therein is shown the structure of FIG. 4 afterplacement of the second device 104. Per this embodiment, the seconddevice 104, which may include a flip-chip device, is formed over thefirst device 102, the opening 202, and the inner lead-finger system 112.The second device 104 is electrically attached to the bump contact 120via the bump bond 122. Preferably, the bump bond 122 should possess aheight sufficient to provide clearance between a second device bottomside 500 and the wire bond 118 of the first device 102.

During attachment, the bump bond 122 of the second device 104 is alignedover the bump contact 120. More specifically, the bump bond 122 can bealigned over and electrically connected to the mesa 126 by targeting themesa 126; or, the bump bond 122 can be aligned over and electricallyconnected to the mesa 126 by targeting the bump bond 122 placementbetween each of the groove 124. Notably, by forming the second device104 over the inner lead-finger system 112, the overall profile or heightof the integrated circuit package system 100 can be reduced by utilizingthe reduced thickness portion of the electrical interconnect system 108.

Referring now to FIG. 6, therein is shown the structure of FIG. 5 afterplacement of the third device 106. The third device 106 is aligned overand attached to the second device 104 via the inter-device structure 110(i.e.—the inter-device structure 110 is formed between the second device104 and the third device 106). Although the third device 106 is depictedas smaller in size than the second device 104, it is to be understoodthat the third device 106 may be the same size or even slightly largerthan the second device 104 to maximize the circuit density within theintegrated circuit package system 100.

Referring now to FIG. 7, therein is shown the structure of FIG. 6 afterformation of the wire bond 118. The wire bond 118 is formed between thethird device 106 and the outer lead-finger system 114.

Referring now to FIG. 8, therein is shown the structure of FIG. 7 afterformation of the encapsulation material 152. The encapsulation material152 covers the first device 102, the second device 104, the third device106, the electrical interconnect system 108, the inter-device structure110, the inner lead-finger system 112, the outer lead-finger system 114,the wire bond 118, the bump bond 122, and portions of the wire bondcontact 116 and the bump contact 120. Notably, due to the support medium200, of FIG. 7, this molding process leaves the first device backside150 and the electrical interconnect system bottom side 154 exposed afterremoval of the support medium 200.

After removal of the support medium 200 the integrated circuit packagesystem 100 can be singulated from the electrical interconnect system 108along tie bar removal lines (not shown). After singulation, theintegrated circuit package system 100 will exhibit or possess thecharacteristics of singulation along its peripheral edges. Thecharacteristics of singulation may include physical features, such asmicro-abrasions, which are indicative of a lasing or mechanical dicingprocess.

Additionally, before or after singulation, a post mold cure process canbe performed to strengthen the encapsulation material 152. Moreover, ifdesired, the electrical contact 156 formed on the electricalinterconnect system bottom side 154 may undergo an optional platingprocess for improved conductivity and bonding.

Referring now to FIG. 9, therein is shown a flow chart of an integratedcircuit package system 900 for the integrated circuit package system 100in accordance with an embodiment of the present invention. Theintegrated circuit package system 900 includes providing an electricalinterconnect system including an inner lead-finger system and an outerlead-finger system in a block 902; stacking a first device, a seconddevice, and a third device between and over the electrical interconnectsystem in a block 904; connecting the first device and the second deviceto the inner lead-finger system in a block 906; and connecting the thirddevice to the outer lead-finger system in a block 908.

It has been discovered that the present invention thus has numerousaspects. One such aspect is that the present invention provides asimplified device stacking process within a reduced profile package. Thepresent invention achieves this through a combination of wire bonding,bump bonding, lead half-etching, and by forming a device within anopening of the electrical interconnect system.

Another aspect of the present invention is that it provides a reducedprofile package with enhanced circuit density while employing a singleelectrical interconnect level system. The present invention achievesthis by stacking three separate devices between and over a singleelectrical interconnect system.

Another aspect of the present invention is that it enhances the thermaldissipation ability of an integrated circuit package system. The presentinvention achieves this by exposing a device backside to an externalenvironment for improved thermal dissipation.

Yet another important aspect of the present invention is that itvaluably supports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

Thus, it has been discovered that the integrated circuit package systemof the present invention furnishes important and heretofore unknown andunavailable solutions, capabilities, and functional aspects forenhancing circuit density within the same interconnect level. Theresulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile and effective, can beimplemented by adapting known technologies, and are thus readily suitedfor efficiently and economically manufacturing integrated circuitpackage devices.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations, which fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

What is claimed is:
 1. A method of manufacture of an integrated circuitpackage system comprising: providing an electrical interconnect systemincluding an inner lead-finger system and an outer lead-finger system;stacking a first device, a second device, and a third device between andover the electrical interconnect system; connecting the first device andthe second device to the inner lead-finger system; and connecting thethird device to the outer lead-finger system.
 2. The method as claimedin claim 1 wherein: providing the electrical interconnect systemincludes half etching or stamping the electrical interconnect system toform the inner lead-finger system.
 3. The method as claimed in claim 1further comprising: exposing a first device backside to an externalenvironment.
 4. A method of manufacture of an integrated circuit packagesystem comprising: providing an electrical interconnect system includingan inner lead-finger system and an outer lead-finger system over asupport medium; attaching a first device to the support medium within anopening defined by the inner lead-finger system; connecting the firstdevice to the inner lead-finger system; connecting a second device tothe inner lead-finger system; attaching a third device to the seconddevice; connecting the third device to the outer lead-finger system;removing the support medium; and encapsulating the integrated circuitpackage system.
 5. The method as claimed in claim 4 wherein: providingthe electrical interconnect system includes providing the innerlead-finger system with a wire bond contact and a bump contact.
 6. Themethod as claimed in claim 4 wherein: providing the electricalinterconnect system includes providing the inner lead-finger system witha bump contact formed by a mesa and a groove.
 7. The method as claimedin claim 4 further comprising: forming an inter-device structure betweenthe third device and the second device.
 8. An integrated circuit packagesystem comprising: an electrical interconnect system including an innerlead-finger system and an outer lead-finger system; a first device, asecond device, and a third device between and over the electricalinterconnect system; the first device and the second device electricallyconnected to the inner lead-finger system; and the third deviceelectrically connected to the outer lead-finger system.
 9. The system asclaimed in claim 8 wherein: the second device is a flip-chip device. 10.The system as claimed in claim 8 wherein: the inner lead-finger systemhas a portion removed within the thickness direction.
 11. The system asclaimed in claim 8 wherein: the first device includes a first devicebackside exposed to an external environment.
 12. The system as claimedin claim 8 wherein: the inner lead-finger system includes a wire bondcontact and a bump contact.
 13. The system as claimed in claim 8wherein: the inner lead-finger system includes a bump contact formed bya mesa and a groove.
 14. The system as claimed in claim 8 wherein: thefirst device is within an opening in the electrical interconnect system.15. The system as claimed in claim 8 further comprising: an inter-devicestructure between the third device and the second device.